Acromag
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New CompactPCI(r) Serial Carrier Card Hosts Two AcroPack(r) Industrial I/O Modules for Data Acquisition, Control, or FPGA Processing
Acromag's new 3U CPCI-S.0 board interfaces two ruggedized mPCIe analog I/O, digital I/O, serial communication, and FPGA mezzanine modules to an embedded computing system.
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Acromag Releases New 6U OpenVPX Single Board Computer with Intel(r) Xeon(r) E3 CPU and Extensive I/O Support
This new processor board provides cost-effective, high-performance computing plus support for many I/O peripherals including XMC and AcroPack(r) mPCIe mezzanine modules.
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New 10-Gigabit Ethernet XMC Modules Feature Quad SFP+ Ports or Dual XAUI Rear I/O and Support for a PCIe x8 Gen3 Interface
Convection and conduction-cooled versions of this 10GbE Network Interface Card (NIC) mezzanine module are available offering front or backplane connections to Intel's XL710 Ethernet Controller.
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Acromag Partners with ECRIN Systems to Offer Extremely Small Mission Computer
AcroPack(r) PCIe Bus interface boards provide customizable I/O in the µONYX SFF computer without the need for interface cables or secondary modules.
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Acromag's New Next Generation I/O Modules for Long-Term Use Introduced at Embedded World 2017
AcroPack I/O mezzanine modules and carriers for PCIe or VPX systems provide a cost-effective solution for a creating application specific customization.
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Acromag's New AcroPack(tm) I/O Platform adds a Reconfigurable Xilinx(r) Artix(r)-7 FPGA for Custom Computing Applications
For embedded computing applications this next generation I/O module offers a PCIe interface format suitable for VPX and ruggedized PCIe-based computers.
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New Rugged COM Express Type 6 Carrier Cards Simplify Development of Small Form Factor Systems
Acromag's new ACEX-4600 COM Express carrier cards greatly reduce system design time by providing a rugged host for Type 6 CPU and PMC/XMC modules that is ready for use in extreme conditions.
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New Rugged COM Express Type 6 Modules Feature Intel Core i7/i5 4th-Gen CPUs and Removable Memory
Acromag's new XCOM-6400 is a ruggedized COM Express module offering high-performance, low-power multi-core processors and a unique SODIMM hold-down that allows users to upgrade memory
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Acromag's New Rugged COM Express Type 6 Modules Feature Intel Core i7/i5 4th-Gen CPUs and Removable Memory
Acromag's new XCOM-6400 is a ruggedized COM Express module offering high-performance, low-power multi-core processors and a unique SODIMM hold-down that allows users to upgrade memory
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New Industrial PC with Modular I/O Employs AMD Geode CPU to Serve Cost-Sensitive Applications
Acromag's newest I/O Server is a fanless box computer that uses AMD's Geode CPU to lower the cost of processing input/output signals in mobile or embedded monitoring and control applications
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