Brandon Lewis, Technology Editor
-
Shrinking automotive AI to smaller form factor for safety, autonomous driving
The automotive industry, just now entering the age of artificial intelligence (AI), is looking at the issues of vehicle safety and training for the future of autonomous vehicles. In this Q and A with Danny Shapiro, senior director of automotive at NVIDIA, he discusses how deep learning technology is being put to use in the pursuit of fully autonomous vehicles, which NVIDIA forecasts as perhaps closer than you might think.
-
Mic check 1, 2, 1, 2: MEMS microphones add reliability for a symphony of IoT apps
Acoustics is one of those sciences most of us take for granted on a regular basis, not because we overlook the importance of sound in our daily lives, but because we underestimate its possibilities beyond speech, music, and as an environmental indicator. Ultrasound, sonar, and noise cancellation are just a few applications that leverage sound waves in capacities that transcend the lay perception of audio.
-
Sensor processing platforms add performance, cut SWaP for the Industrial Internet
As the Industrial Internet demands more out of resource-constrained industrial data acquisition systems, sensor processing platforms are required to add performance while reducing size, weight, and power (SWaP). Rubin Dhillon, Marketing Director of the Embedded Systems division at GE Intelligent Platforms discusses his company’s approach to developing “brilliant machines,” and how off-the-shelf hardware is enabling these sensor platforms for the Industrial Internet.
-
Where art thou, PowerPC?
Once the predominant RISC architecture in the embedded space, PowerPC has seen brighter days and is now giving way to hybrid designs that integrate FPGAs within ARM-based Systems-on-Chip (SoCs).
-
COM Express mini, Qseven, SMARC meet at the crossroads of an evolving processor landscape
COM Express Type 10, Qseven, and SMARC are all vying for position as ARM-based processors take hold in SFFs.
-
MILCOM meetings project SFF surge, standardizedPC/104 packaging possibilities
MILCOM shows SFF trend, vendors discuss standardized packaging for PC/104.
-
Intel Atom E3800 SoCs improve power, performance for SFF designs
Improvements to the Intel Atom family of processors have yielded a new class of Systems-on-Chip (SoCs) that provide a range of core, clock speed, and thermal envelope options in a scalable package for small form factor developers. Max Domeika, Embedded Software Technologist, Developer Products Division, Intel Corporation, reviews some of the features and benefits of the new SoCs, as well as some of the tools available to aid in processor migration. Edited excerpts follow.
-
SFF market fragmentation continues, x86 and ARM set to square off
Analysts offer insight on the financials of the merchant board market.
-
PCIe/104 extends legacy of service in mil/aero
Interoperability, mechanical ruggedness, and limited Size, Weight, and Power (SWaP) are precursors of every new military/avionics system design, but an evolving military landscape also requires improved bus speeds for applications like HD video transmission. In response, a recent revision to the PCIe/104 specification added support for PCI Express Gen 2 and Gen 3, improving data rates and providing support for new processor solutions. However, the true strengths of PCIe/104 in defense applications are those inherited from the proven legacy of the stack.
-
Social shock and big acquisitions
See www.linkedin.com/ groups/PC104-Small-Form-Factors-PC-1854269 for a precursor to this column.
Brandon Lewis, Technology Editor
Brandon Lewis, Technology Editor
Brandon Lewis, Technology Editor
Brandon Lewis, Technology Editor
Brandon Lewis, Technology Editor- 1
- 2
