congatec Unveils Latest Module in COM Express Family Based On Intel Atom Processor N270 and Mobile Intel 945GSE Express Chipset
Economically-Priced, Low-Power Compact Module Targeted At Full-Featured Mobile Applications
The Qseven™ consortium, initiated by congatec AG and SECO, announced the addition of two embedded computer module vendors.
Enables all types of ultra mobile and fanless applications
70x70mm size for low power chipsets such as Menlow