Diamond Systems
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FeaturePak I/O Standard Gains Members, Products, Trade Association
The FeaturePak initiative, unveiled last month at Embedded World in Nuremberg, Germany, today announced new members and FeaturePak-related products, and revealed that it is formally organizing as the nonprofit "FeaturePak Trade Association." The initiative's newest members are VIA Technologies Inc. and MSC Vertriebs GmbH, which join the eight charter members that jointly launched the nascent embedded I/O standard last month.
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FeaturePak Embedded I/O Comes to SUMIT-ISM Stacks
Diamond Systems unveils an adapter board that allows the use of FeaturePak I/O expansion modules in systems that provide SUMIT-ISM expansion stack locations. The SUMIT/FP Adapter provides a pair of 50-pin I/O header connectors for convenient access to all FeaturePak I/O and consumes a single PCI Express x1 lane from the SUMIT-A bus connector. In addition, it includes pass-through connectors for the SUMIT-ISM stack's SUMIT-B bus and PC/104 (ISA) bus. An extended operation temperature range of -40oC to +85oC is supported.
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FeaturePak Module Features 96 Programmable Digital I/O Lines
Diamond Systems Corporation today launched the industry's first digital I/O module compatible with the recently-introduced FeaturePak embedded I/O expansion standard. The FP-GPIO96 integrates 96 buffered, programmable digital I/O lines, eight 32-bit counter/timers, four 24-bit pulse-width modulation circuits, and a watchdog timer. It interfaces to host systems via the FeaturePak host interface's high-speed PCI Express bus interface.
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Boardset Merges COM Express Cores with Triple-Play I/O
COM Express-sized Magellan boardset offers the advantages of both COMs and SBCs, and provides "triple-play expansion" via PCI-104, SUMIT, and FeaturePak modules
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COM Express Modules Take the Heat
Leading embedded solution provider debuts wide-temperature COM Express Modules based on low-power Intel(r) Atom and Core 2 Duo CPUs
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Diamond Mints "World's First" FeaturePak DAQ Module
Tiny, high-accuracy data acquisition module provides snap-in A/D, D/A, and DIO functions for COM baseboards, SBCs, and full-custom electronic designs
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Diamond Systems Joins Qseven Consortium
Leading embedded solution provider to team up Qseven(tm) computer-on-modules with FeaturePak(tm) I/O modules for rapid development of application-oriented OEM baseboards
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Tiny Embedded I/O Expansion Card Format Taps PCI Express
Eight companies in the global embedded computing market jointly unveiled the FeaturePak(tm) standard and products at the Embedded World tradeshow in Nuremberg, Germany.
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Diamond Spins Linux 2.6.23 SDKs
Diamond Systems Corp., a leading supplier of ruggedized single-board computer (SBC), embedded-ready subsystem (ERS), and I/O expansion modules targeting real-world applications, today launched a series of Linux Software Development Kits (SDKs). Each SDK includes a tiny solid-state IDE "flashdisk" module - preloaded with a Linux(r) OS - that plugs directly into one of Diamond's SBC or ERS products, ready to boot and run immediately.
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Diamond Spins Linux 2.6.23 SDKs
Diamond Systems Corp. today launched a series of Linux Software Development Kits (SDKs). Each SDK includes a tiny solid-state IDE "flashdisk" module - preloaded with a Linux OS - that plugs directly into one of Diamond's SBC or ERS products, ready to boot and run immediately. With all required drivers pre-configured and ready to use, these Linux-bootable flashdisks complement Diamond's reliable processor modules to create solid-state Linux-based embedded computers.
Diamond Systems