Jerry Gipper, Editorial Director
Several conditions have come together in recent years to drive innovation in even smaller form factors. First, the continued integration of processors to include memory controllers, I/O, and serial fabrics such as Ethernet and PCI Express; and second, a rapidly expanding market need for high-performance, small computing platforms for unmanned mobile vehicles. But new initiatives are different. Standards developers have had rugged and mobile applications in mind from the get-go. They are taking into consideration various cooling strategies from convection to conduction, focusing on lower module mass, and keeping performance and serviceability at the forefront.