Lee Jones, Nuventix
To say that Moore’s Law is now in full effect would be an understatement; electronics are becoming exponentially more fast and powerful at an ever-increasing rate. Meanwhile, the sizes of the devices are becoming smaller and smaller, largely due to the needs and wants of consumers. While there seems to be no limit as to how powerful chip designers can make speed and storage, there are several barriers to how small we can continue to make the products that utilize these chips. One of the most critical of these barriers is proper thermal management. Synthetic jet cooling offers very high heat transfer rates in very compact, highly reliable packages. This enables products to achieve the small size and power density associated with active cooling, without the low system Mean Time Between Failure (MTBF) of fans.