TE Connectivity
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TE Connectivity Introduces Half-Size VITA 66.4 Module for Embedded Computing
New Ruggedized Backplane Interconnects Support VITA 66.1 and 66.4 Standards
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TE Connectivity Completes Acquisition of Measurement Specialties, Inc.
Establishes TE as a Leader in the High-Growth Sensor Market; Expands TE's Leadership Position in Harsh Environment Applications
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TE Connectivity Offers Black Zinc Nickel Plating for Connectors and Backshells
New Plating is RoHS-Compliant Alternative to Cadmium Plating
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TE Connectivity Experts to Present at Advanced Aircraft Cabling Conference
- Lecture and Interactive Workshop Offered for Aerospace Engineers -
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TE Connectivity Completes Acquisition of the SEACON Group
Expands Range of Connectivity Solutions for the Oil and Gas Sector
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Te Connectivity Recognizes Top Performing Distributors With Awards For Outstanding Achievements In 2013
Avnet Electronics Marketing and Mouser Electronics, Inc. honored with TE's 2013 Global Distributor of the Year Awards
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TE Connectivity Introduces Three New Connectors To Its Economy Power 2.5 Series
Application Tooling Features, Wire-to-Wire and Wire-to-Board Connectors Offer Complete Customer Solution
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TE Connectivity Introduces 0.35mm Fine Pitch Scalable Board-to-board Connector For High-performance, Thinner Smartphones
TE Connectivity (TE) today released a 0.35mm fine pitch scalable board-to-board (BtB) connector featuring a body width of 1.85mm, one of the narrowest on the market.
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Pioneering CeeLok FAS-T Connector System Features Field Terminable , Crimp-Snap, 1O GB Ethernet Technology
System Provides Future-Proof Interface for Aerospace, Defense and Marine Markets
TE Connectivity