News - Industry News
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Themis announces next generation customizable rugged small form factor computer for military applications
Applications on the tactical edge require increasingly lighter, quieter, and more versatile computers, with the new Nanopak i7, soldiers can process data quietly in their backpacks while in the field.
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Sundance places PC/104 EMC2 demonstration platform into the public domain and declares EU's Artemis EMC2 project a success
As the EU's Artemis EMC2 project draws to close, Sundance places the EMC2-DP demonstration platform, which also forms the basis of its commercially available EMC2-compliant PC/104 product portfolio, into the public domain on CERN's Open Hardware Repository.
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Mistral introduces its Compact and Powerful 820 Nano SOM for miniature embedded applications
High performance module based on Qualcomm Snapdragon 820 processor
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Tianma NLT USA introduces new LCD Modules with Ultra-High Luminance
Tianma NLT USA has introduced four new outdoor viewable liquid crystal displays: an 8.0-inch diagonal WVGA, a 12.1-inch WXGA, a 15.0-inch XGA, and a 15.6-inch Full HD.
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288 Core ARM(r) and 13'824 CUDA core microserver cluster with Toradex Apalis System on Modules by Christmann
RECS(r)|Box Atlas Quad Apalis, evaluation platform for up to 4 Apalis modules Toradex is excited to welcome Christmann Informationstechnik + Medien GmbH & Co. KG from Germany in its partner program. Christmann is offering the RECS(r)|Box Atlas Quad Apalis Evaluation platform, and the RECS(r)|Box Antares and Arneb 19" 1RU server enclosures which can run 24 and 72 Apalis System on Modules respectively in a cluster configuration.
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LCD Manufacturer Tianma Microelectronics Adopts New Company Name for Three Overseas Subsidiaries
Change unifies Tianma corporate brand and logo for Japan, the Americas and Europe
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Gore's High Data Rate Cables For Military & Civil Aircraft Applications Showcased In Schleuniger's Wire Processing Equipment
W. L. Gore & Associates, Inc. (Gore) is pleased to announce that Schleuniger, a leading international manufacturer of wire processing equipment, will showcase Gore's high data rate cables for military and civil aircraft applications at the 2017 Electrical Wire Processing Technology Expo in Milwaukee, WI, May 10-11, Booth 1732.
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Network, Engage, Learn and Connect at What's New in Electronics Live
EMC UK Expo and Technical Workshops plus The Embedded and Developer Expo will be running in association with What's New in Electronics Live next month at The NEC, Birmingham. Bringing together the world of electronics it is a must attend event.
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Gore Exhibiting New And Proven Fabrics, Cables And Materials For Military And Defense Applications
W. L. Gore & Associates, Inc. (Gore) will be featuring products from GORE(r) Military Fabrics, GORE(tm) SKYFLEX(tm) Aerospace Materials and GORE(r) Cables and Materials at the 2017 Army Aviation Mission Solutions Summit 2017 Army Aviation Mission Solutions Summit in Nashville, TN, April, 26-28, Booth 1045.
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DFI's New Products with 7th Gen Intel(r) Core(tm) Processors
DFI's upcoming boards with 7th Generation Intel(r) Core(tm) processor (code name Kaby Lake) bring customers overall enhanced experiences such as low-power with a TDP of 15W, increased CPU performance by 5%, visual enhancement with lower power consumption, and faster speed shift technology.
Themis Computer
Sundance Multiprocessor Technology
What\'s New in Electronics Live