COM Express Modules Take the Heat

Leading embedded solution provider debuts wide-temperature COM Express Modules based on low-power Intel(r) Atom and Core 2 Duo CPUs

COM Express Atom Module
COM Express Atom Module

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and I/O expansion modules targeting real-world applications, today launched a family of COM Express 1.0 compliant computer-on-modules (COMs) based on Intel’s low-power, high-performance Atom and Core processors. Rated for operation over enhanced ( 20o to +71o C) and extended ( 40o to +85o C) temperature ranges, the modules are well suited to a broad range of fixed and mobile applications in the defense, avionics, transportation, energy management, and industrial automation sectors.

Within the industry-standard 3.7 x 4.9-inch (95 x 125 mm) COM Express footprint, the CME-Atom and CME-965 each integrate a high-performance, low-power Intel processor, DDR2 SDRAM, and a complete set of PC-compatible system controllers and interfaces. Both modules provide eight USB 2.0 ports, a gigabit Ethernet LAN interface, high-resolution VGA CRT and LVDS LCD video, audio in and out, and mass storage interfaces. Additionally, both provide PCI Express, 32-bit PCI, and LPC expansion bus signals for connection to external generic or application-specific baseboards.

Supported operating systems currently include Windows XP and Linux 2.6, with support for additional OSes and RTOSes (real-time OSes) available on request.

Pricing and Availability

Small quantities of the CME-Atom and CME-965 COMs are available within 30 days.

Also available are several pre-integrated development kits, which include generic or application-oriented COM Express baseboards, complete sets of interface cables, OS driver software, and comprehensive documentation. Contact Diamond Systems regarding development kit pricing, volume discounts, and application-specific customization services.

About Diamond Systems

Founded in 1989, Diamond Systems Corporation is a leading supplier of compact, rugged, wide-temperature embedded computing solutions for a wide range of applications in fixed and mobile environments. The company is the originator of the FeaturePak I/O modules standard, was an early adopter of PC/104 technology and today is one of the leading worldwide suppliers of embedded I/O modules and highly integrated single board computers combining CPU and data acquisition on a single board. Diamond’s extensive product line includes A/D, D/A, digital I/O, serial communications, wired and wireless networking, and power supply modules as well as single-board computers and enclosures. Diamond also offers a full range of system solutions, including the capability to customize boards or systems to meet the needs of a particular application. The privately held company is based in Mountain View, California, in the heart of Silicon Valley. For more information, visit www.diamondsystems.com or call 1-800-36-PC104.