processing
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Preparations in full swing for embedded world 2017
Knowledge transfer of the highest calibre Innovative new products and the latest industry trends Online registration - get your e-ticket today! Arrange appointments with exhibitors
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Portwell Releases New Qseven 2.1 Module with Intel Atom Processor E3900 Series, Pentium and Celeron Processors
Portwell's PQ7-M108, a Qseven 2.1 module based on Intel Atom Processor E3900 series, Intel Pentium processor N4200, and Intel Celeron processor N3350 (codenamed Apollo Lake), features Infineon OPTIGA Trust IC, industrial temperature support for -40°C to 85°C, and Intel Gen 9 graphics with triple display support in high resolution.
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WinSystems Debuts Single Board Computers Built on Intel Atom E3900 Series CPU in PC/104 Form Factor for High-Reliability Industrial Environments
First PCIe(r)/104 OneBank(r) E3900-based product for industrial operations boosts processing performance, offers dense mix of I/O interfaces, connectivity and expansion options in a small size
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Aldec Delivers Verification Support for Embedded Applications with New TySOM Embedded Development Kit
Henderson, NV - August 17, 2016 - Aldec, Inc., a pioneer in mixed-HDL language simulation and hardware-assisted verification solutions for FPGAs and ASICs, today announced the release of TySOM(tm) Embedded Development Kit (EDK). The TySOM EDK targets embedded designers who require a platform with higher-performance RTL simulation and debugging for developing leading-edge embedded applications for IoT, Computer Vision, Automotive, Robotics and Factory Automation.
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Intel SoC FPGA Developer Forum: ReFLEX CES Showcases Arria10 SoC FPGA Cards and OpenCL Solutions
ReFLEX CES Arria10 SoC solutions @ the ISDF show in San Francisco
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COMMELL unveils new products based on Skylake-U processors
COMMELL, the worldwide leader of Industrial Single Board Computers, unveils Embedded boards in various form factors based on Intel(r) 6th generation "Skylake-U" Core(tm) processor family. these Embedded boards include Mini-ITX LV-67T, Pico-ITX LP-175 and 3.5" miniboard LE-37G.
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Acromag's New AcroPack(tm) I/O Platform adds a Reconfigurable Xilinx(r) Artix(r)-7 FPGA for Custom Computing Applications
For embedded computing applications this next generation I/O module offers a PCIe interface format suitable for VPX and ruggedized PCIe-based computers.
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Windows Embedded Compact 2013 BSP Support for NXP i.MX7 series processor
iWave Systems, eminently known worldwide for NXP i.MX based solutions, has brought up the WEC2013 (Windows Embedded Compact 2013) on NXP i.MX7 series processor, providing support for WEC2013 reference Board Support Package (BSP) for NXP's i.MX7D SDP board. With this expertise, iWave has proved that it can support WEC2013 BSP on any i.MX7x based custom boards. The i.MX7 series is a highly integrated multi-market applications processor designed to enable secure and portable applications within the Internet of Things. The i.MX7 series is the first device in the market utilizing both the ARM(r) Cortex(r)-A7 and Cortex-M4 cores for general purpose programmable processing.
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Embedded Computing Market is Estimated to Generate $236.5 Billion by 2022 - Allied Market Research
Embedded Computing Market report provides insights on types of computing systems. It indicates that market would register a CAGR of 6.2% from 2016 to 2022.
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Sundance adds Xilinx's new Kintex UltraScale FPGA to its EMC2 family of PCIe/104 "OneBank" compatible I/O boards
The new EMC2-KU35 is a stackable FPGA module with Gen2 PCI Express interfaces that are "OneBank" compatible and has a VITA57.1 FMC I/O slot controlled by a Kintex UltraScale KU35 FPGA, and is fully supported by the latest Xilinx Vivado tools.
Embedded World
American Portwell Technology, Inc.
iWave systems technology
Allied Market Research
Sundance Multiprocessor Technology