SECO at Embedded World 2014 Nuremberg (Germany), embedded world 2014, 25th - 27 th February, 2014

Highlights at the show include:

- The unveiling of the modules based on the AMD G-Series SoC (System-on-Chip) platform in Qseven® 2.0 and Pico-ITX form factors. The wide selection of Quad and Dual Core SoCs, with their different embedded GPUs, allows achieving very high levels of performance

- The presentation of the newest Qseven® 2.0 module based on the 3rd Generation Intel® Atom™ processors (Bay Trail), the first System-on-Chip (SoC), delivering outstanding compute, graphical, and media performance while operating in an extended range of thermal conditions.

- The exhibition of the high end COM-Express™ Type 6 Module based on the 4th Generation Intel® Core™ processors. The product offers stunning visuals, graphics performance and enhanced security, without the cost of a separate graphics card.

Visitors can also learn more about SECO’s solutions based on Freescale™ i.MX6, NVIDIA® Tegra® T30, Intel® Atom™ Cedar View Family and AMD Embedded R-Series Family Processors. You can find these products available in different form factors: Qseven®, μQseven, COM Express™ and Single Board computer.

More information on SECO’s latest products are available on which has recently been redesigned to improve user friendliness and appeal. In addition to the changed design and improved navigability, new functions such as a product comparison service and fast access to downloadable resources have been implemented.