COMs
COM Express, COMIT, CoreExpress, ITX, Mini-ITX, Nano-ITX, Pico-ITX, Qseven
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Small form factors, big time markets
Whether you're talking about PC/104 and PCe/104 for rail and military applications or COM Express for gaming and IoT applications, small-form-factor solutions for embedded computing are hot across multiple markets. Reduced size, weight, and power (SWaP) requirements are spurring innovation in smaller footprint designs that pack as much performance as larger solutions.
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Global Virtual and Augmented Reality Market to Grow at Over 90% CAGR through 2024
The worldwide market for virtual and augmented reality is estimated to report an exponential CAGR of 92.50% between 2016 and 2024, increasing its overall opportunity to US$547.20 bn by the end of 2024.
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Introducing the Zeta Family of Miniature COM-based SBCs
Zeta Targets Applications Requiring High I/O, Long Life and compact size
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Multipurpose Digital I/O Module DIC324
DIC324 digital I/O module is implemented in PC/104+ format.
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New congatec quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
congatec lays foundation for modular micro server designs
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Mistral introduces its Compact and Powerful 820 Nano SOM for miniature embedded applications
High performance module based on Qualcomm Snapdragon 820 processor
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New ARBOR Qseven CPU module with single-chip, quad-core Intel(r) Pentium(r) N4200 / dual-core Celeron(r) N3350 processor
ARBOR announces the immediate availability of the EmQ-i2401 Qseven module, based on the new Intel(r) Pentium(r) / Celeron(r) processors (Intel(r) codenamed Apollo Lake).
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SECO introduces the COM Express(tm) Type 6 with the AMD Embedded G-Series SoC J Family (formerly codenamed "Prairie Falcon")
SECO extends its COM Express product portfolio with the introduction of the 3rd Generation AMD Embedded GSeries SoC J Family (formerly codenamed "Prairie Falcon"), on its COMe-A98-CT6 presented at Embedded World 2017.
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SECO's roadmap from NXP i.MX 6 to i.MX 8M
Amongst the most important innovations, SECO introduces an updated version of its Q7-928, a Qseven(r) standard module featuring the NXP(r) i.MX 6DualPlus applications processor that offers top computational and graphical performances given by the low-power consuming ARM architecture. The i.MX 6DualPlus processor is also an option for the SBC-A62-J, a low-end Single Board Computer that exploits the potential of a configurable expansion connector to fully meet the configuration flexibility needs. Both solutions can now benefit from the increased performances and enhanced 3D graphics delivered by the i.MX 6DualPlus processor.
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SECO's broad range of Intel-based solutions
The increasing complexity of connected machines and the quick development of IoT infrastructures require enhanced processing power and exceptional efficiency, as well as the ability of handling several tasks simultaneously. Believing in the amazing possibilities of the latest generations of Intel processors, SECO manufactures its Intel-based products to fully meet these computational performance and energy efficiency needs, and conforming it to the most innovative and consolidated standard form factors.
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Diamond Systems
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congatec Inc