Expansion
SUMIT Connector, Pico-I/O, Pico-ITXe, MiniBlade, XR-DIMM
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Small form factors, big time markets
Whether you're talking about PC/104 and PCe/104 for rail and military applications or COM Express for gaming and IoT applications, small-form-factor solutions for embedded computing are hot across multiple markets. Reduced size, weight, and power (SWaP) requirements are spurring innovation in smaller footprint designs that pack as much performance as larger solutions.
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Global Virtual and Augmented Reality Market to Grow at Over 90% CAGR through 2024
The worldwide market for virtual and augmented reality is estimated to report an exponential CAGR of 92.50% between 2016 and 2024, increasing its overall opportunity to US$547.20 bn by the end of 2024.
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Multipurpose Digital I/O Module DIC324
DIC324 digital I/O module is implemented in PC/104+ format.
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History of the PC/104 Consortium
The PC/104 Consortium was established in February 1992 by 12 companies with a common vision of adapting desktop computer technology for embedded applications. This consortium has had a tremendous, positive effect on the embedded computer marketplace. The initial release of the PC/104 specification in March of 1992 was an open design offering the power and flexibility of an IBM compatible personal computer in a size ideally suited for embedding. Simple and elegant in design, while small but rugged in performance, PC/104 technology bridged the successes of the past with the promises of future innovations.
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PC/104: A fresh look in its 25th year
Let's take a moment to recall the significance of 1987 - thirty years ago. You may immediately think, "Yes. 1987. A fantastic year for the birth of tennis stars: Andy Murray, Novak Djokovic, Maria Sharapova, Ana Ivanovic, and Sara Errani were all born in '87." But I imagine your second thought is about PC/104, right? Well, it could be if you know your PC/104 history: 1987 marks the year that Ampro introduced the Little Board/PC single-board computer - one of the earliest seeds of the PC/104 ecosystem. Early collaborators such as Real Time Devices (now RTD Embedded Technologies) and Diamond Systems began developing compatible products as interest grew in the modular building block concept. By 1989, an innovative plug-in mezzanine concept was introduced; it was perhaps the first look at a stackable bus structure that could eliminate the need for a backplane. As the form and function of the 3.775-inch by 3.550-inch stackable PC architecture began to take shape, Ampro made the industry-changing decision to spin its proprietary form factor into an open standard. In 1992, twelve trailblazing companies would join together to establish the PC/104 specification and the consortium that bears its name. Stackable expansion buses, corner mounting holes, and a compact footprint proved to be a winning combination which quickly found popularity among embedded system designers. (Note: Many thanks to Rick Lehrbaum for his previous publications chronicling the early history of PC/104.)
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PCIe/104 - The "fishal" recognition revolution in fish counting
Fish-count surveys are vital in ensuring the conservation and management of fish stocks in our increasingly overfished seas. The accuracy of those surveys is critical in providing evidence of overfishing to drive restorative and preventative legislation. Traditional fish-counting is inherently manual, relying on fishing trawlers casting enormous nets into the ocean, pulling aboard as many fish as possible to manually count and develop the trawl survey.
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Version 2.0: The evolution of SMARC module specification
Earlier this year, the Standardization Group for Embedded Technologies (SGET) updated its Smart Mobility Architecture (SMARC) embedded computing format to the 2.0 specification. Since its inception three years ago, the SMARC small-form-factor module has given developers an innovation boost for the ultra-low-power embedded market. Due to its widespread adoption and successful application, SGET members determined that Version 2.0 was needed to support next-generation design requirements.
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A go-to embedded solution
There was a time when I watched the cooking competition television show "Chopped" somewhat regularly. It's an intense ingredients-based culinary challenge that pushes chefs to their limits under strict time constraints. Amidst the nearly endless food combinations available to the contestants, it seems as though every episode I watched included one person (and sometimes two or three) who used mascarpone cheese. Often in the dessert round, the chef's storytelling voiceover (dripping with tension) would recount, "I ran to the pantry. I grabbed the mascarpone ... "
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Chenbro Debuts 2U 24 Bay High Disk I/O Performance Server/Storage Chassis - RM23624
Density Storage Server Chassis with 12Gb/s SAS Expander Fits 24 Hot Swappable 2.5" hard drives
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Valens Selects Silicon Creations' SerDes IP for the Colligo Chipsets
IP Delivers Performance for HDBaseT Protocol to Guarantee High Standards
Market Research Reports Search Engine
www.fastwel.com
Stephen St. Amant, PC/104 Consortium President
Rory Dear, European Editor/Technical Contributor
Stephen St. Amant, PC/104 Consortium President
Chenbro
Silicon Creations