Expansion
SUMIT Connector, Pico-I/O, Pico-ITXe, MiniBlade, XR-DIMM
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Version 2.0: The evolution of SMARC module specification
Earlier this year, the Standardization Group for Embedded Technologies (SGET) updated its Smart Mobility Architecture (SMARC) embedded computing format to the 2.0 specification. Since its inception three years ago, the SMARC small-form-factor module has given developers an innovation boost for the ultra-low-power embedded market. Due to its widespread adoption and successful application, SGET members determined that Version 2.0 was needed to support next-generation design requirements.
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A go-to embedded solution
There was a time when I watched the cooking competition television show "Chopped" somewhat regularly. It's an intense ingredients-based culinary challenge that pushes chefs to their limits under strict time constraints. Amidst the nearly endless food combinations available to the contestants, it seems as though every episode I watched included one person (and sometimes two or three) who used mascarpone cheese. Often in the dessert round, the chef's storytelling voiceover (dripping with tension) would recount, "I ran to the pantry. I grabbed the mascarpone ... "
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Chenbro Debuts 2U 24 Bay High Disk I/O Performance Server/Storage Chassis - RM23624
Density Storage Server Chassis with 12Gb/s SAS Expander Fits 24 Hot Swappable 2.5" hard drives
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Valens Selects Silicon Creations' SerDes IP for the Colligo Chipsets
IP Delivers Performance for HDBaseT Protocol to Guarantee High Standards
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Uniquify to Present High-Performance DDR3 Memory System in Low-Cost Wire Bond Package, Fastest DDR4 Memory IP at CSIA-ICCAD 2014 in Hong Kong
Will Offer Look at LPDDR4 Available in 14nm FinFET
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eCosCentric adds integrated USB Device support to eCosPro
eCosCentric introduces a USB device stack for eCosPro, tightly integrated with the eCos IO and IPv6 networking layers. Provides network and serial connectivity, complementing host stack capability.
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Innodisk Expands Embedded Peripheral Series with Communication Modules, for IoT and Embedded Applications.
Expansion Modules add Gigabit-Ethernet or Multiport Serial Connectivity
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Intelligent Memory Introduces Revolutionary New DRAM Components With On Chip Error Correcting Code (ECC) Functionality
Revolutionary new JEDEC compliant DRAM IC is available in DDR1, DDR2, DDR3, and LPDDR, and brings server grade reliability to a board level in any application.
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Sensoray Release New HD/SD USB Audio/Video Encoder
Video capture from various HD and SD sources: DVI, component.
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Kilopass Appoints Pioneer NVM Developer Christophe Chevallier Vice President of Engineering to Drive Kilopass NVM Memory Enablement
Chevallier's 20 Years of NVM Engineering Management Experience to Expand Kilopass' Scope and Bandwidth in NVM Business
Stephen St. Amant, PC/104 Consortium President
Chenbro
Silicon Creations
Intelligent Memory
