Expansion
SUMIT Connector, Pico-I/O, Pico-ITXe, MiniBlade, XR-DIMM
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Molex Showcased NeoScale High-Speed Mezzanine System at DesignCon
With remarkably clean signal integrity at 28+ Gbps, the NeoScale system features a high-speed triad wafer design with Solder-Charge Technology
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Ruggedizing RAM for industrial systems
When it comes to rugged computing, the ANSI/VITA 47-2005 (R2007) specification has earned its stripes as a guide for validation testing and product development.
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Mitigating USB DAQ design challenges with onboard intelligence
Data Acquisition and Control (DAQ) systems come in many varieties, each with unique challenges. Some of these challenges are not obvious to designers that are new to DAQ systems. The incorporation of USB in DAQ systems can ease system design, but it can also introduce new, USB-specific wrinkles. Using onboard intelligence can greatly broaden the range of DAQ applications suited to USB.
Molex
