hardware
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Themis announces next generation customizable rugged small form factor computer for military applications
Applications on the tactical edge require increasingly lighter, quieter, and more versatile computers, with the new Nanopak i7, soldiers can process data quietly in their backpacks while in the field.
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Flexible, modular Skylake PICMG 1.3 CPU card from ICP Deutschland
The new Skylake PICMG 1.3 CPU card from ICP Deutschland and various backplane variants from a flexible modular system for the development of expandable and compact industrial PC for system control and image processing.
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DFI Tech Announces New 7th Generation Intel Atom SoC Motherboards
DFI Tech, a provider of embedded computing solutions and board products, has released new motherboards using the latest generation low-power System-on-Chip (SoC) processors from Intel(r).
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Sundance places PC/104 EMC2 demonstration platform into the public domain and declares EU's Artemis EMC2 project a success
As the EU's Artemis EMC2 project draws to close, Sundance places the EMC2-DP demonstration platform, which also forms the basis of its commercially available EMC2-compliant PC/104 product portfolio, into the public domain on CERN's Open Hardware Repository.
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Tianma NLT USA Introduces Thin and Lightweight Industrial 15.0-inch LCD module
Tianma NLT USA has announced the introduction of a thin and lightweight 15.0-inch diagonal LCD module with XGA resolution (1024 x 768 pixels, P/N NL10276AC30-53D) for industrial applications such as POS and ATMs.
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LCD Manufacturer Tianma Microelectronics Adopts New Company Name for Three Overseas Subsidiaries
Change unifies Tianma corporate brand and logo for Japan, the Americas and Europe
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Gore's High Data Rate Cables For Military & Civil Aircraft Applications Showcased In Schleuniger's Wire Processing Equipment
W. L. Gore & Associates, Inc. (Gore) is pleased to announce that Schleuniger, a leading international manufacturer of wire processing equipment, will showcase Gore's high data rate cables for military and civil aircraft applications at the 2017 Electrical Wire Processing Technology Expo in Milwaukee, WI, May 10-11, Booth 1732.
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Gore Exhibiting New And Proven Fabrics, Cables And Materials For Military And Defense Applications
W. L. Gore & Associates, Inc. (Gore) will be featuring products from GORE(r) Military Fabrics, GORE(tm) SKYFLEX(tm) Aerospace Materials and GORE(r) Cables and Materials at the 2017 Army Aviation Mission Solutions Summit 2017 Army Aviation Mission Solutions Summit in Nashville, TN, April, 26-28, Booth 1045.
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DFI's New Products with 7th Gen Intel(r) Core(tm) Processors
DFI's upcoming boards with 7th Generation Intel(r) Core(tm) processor (code name Kaby Lake) bring customers overall enhanced experiences such as low-power with a TDP of 15W, increased CPU performance by 5%, visual enhancement with lower power consumption, and faster speed shift technology.
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New ARBOR Qseven CPU module with single-chip, quad-core Intel(r) Pentium(r) N4200 / dual-core Celeron(r) N3350 processor
ARBOR announces the immediate availability of the EmQ-i2401 Qseven module, based on the new Intel(r) Pentium(r) / Celeron(r) processors (Intel(r) codenamed Apollo Lake).
Themis Computer
ICP Deutschland GmbH
DFI Technologies
Sundance Multiprocessor Technology