hardware
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Tianma NLT USA Introduces Thin and Lightweight Industrial 15.0-inch LCD module
Tianma NLT USA has announced the introduction of a thin and lightweight 15.0-inch diagonal LCD module with XGA resolution (1024 x 768 pixels, P/N NL10276AC30-53D) for industrial applications such as POS and ATMs.
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LCD Manufacturer Tianma Microelectronics Adopts New Company Name for Three Overseas Subsidiaries
Change unifies Tianma corporate brand and logo for Japan, the Americas and Europe
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Gore's High Data Rate Cables For Military & Civil Aircraft Applications Showcased In Schleuniger's Wire Processing Equipment
W. L. Gore & Associates, Inc. (Gore) is pleased to announce that Schleuniger, a leading international manufacturer of wire processing equipment, will showcase Gore's high data rate cables for military and civil aircraft applications at the 2017 Electrical Wire Processing Technology Expo in Milwaukee, WI, May 10-11, Booth 1732.
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Gore Exhibiting New And Proven Fabrics, Cables And Materials For Military And Defense Applications
W. L. Gore & Associates, Inc. (Gore) will be featuring products from GORE(r) Military Fabrics, GORE(tm) SKYFLEX(tm) Aerospace Materials and GORE(r) Cables and Materials at the 2017 Army Aviation Mission Solutions Summit 2017 Army Aviation Mission Solutions Summit in Nashville, TN, April, 26-28, Booth 1045.
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DFI's New Products with 7th Gen Intel(r) Core(tm) Processors
DFI's upcoming boards with 7th Generation Intel(r) Core(tm) processor (code name Kaby Lake) bring customers overall enhanced experiences such as low-power with a TDP of 15W, increased CPU performance by 5%, visual enhancement with lower power consumption, and faster speed shift technology.
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New ARBOR Qseven CPU module with single-chip, quad-core Intel(r) Pentium(r) N4200 / dual-core Celeron(r) N3350 processor
ARBOR announces the immediate availability of the EmQ-i2401 Qseven module, based on the new Intel(r) Pentium(r) / Celeron(r) processors (Intel(r) codenamed Apollo Lake).
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congatec welcomes official release of the COM Express 3.0 specification
congatec's Type 7 Server-on-Modules are now PICMG standard
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Module COM Express СРС1302 - More Power, More Capabilities
Fastwel launches its new high-performance computer module CPC1302 based on the Intel 5th Generation CPUs ("Broadwell").
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PICMG Announces The Ratification of COM0 R.3 for COM Express for Server Grade Performance
PICMG, a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open specifications, has announced the release of a high-performance revision that adds server-grade functionality to COM Express embedded computing systems. COM Express is widely used in Industrial Automation, Military/Aerospace, Gaming, Medical, Transportation, IoT, and other applications.
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From head to toe focused on image processing
The embedded box PC TANK-870-Q170 from ICP Deutschland is especially made for the usage in image processing applications. It combines an optional POE expansion, RAID function and different PCI, PCIe and PCIe MIni Card expansion possibilities.
Macrovision, Inc.
congatec Inc
Fastwel.com
ICP Deutschland GmbH