SoC
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EnSilica boosts SoC design and supply services with two senior-level appointments
EnSilica has announced two senior-level appointments designed to significantly boost its rapidly expanding full System-on-Chip (SoC) services as the company continues to expand its base of customers seeking complex, full-service custom analog and mixed-signal chip design and supply. EnSilica has appointed David Tester to the newly created position of Director of SoC Architecture and Patrick McNamee to the newly created position of Director of Silicon Operations.
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288 Core ARM(r) and 13'824 CUDA core microserver cluster with Toradex Apalis System on Modules by Christmann
RECS(r)|Box Atlas Quad Apalis, evaluation platform for up to 4 Apalis modules Toradex is excited to welcome Christmann Informationstechnik + Medien GmbH & Co. KG from Germany in its partner program. Christmann is offering the RECS(r)|Box Atlas Quad Apalis Evaluation platform, and the RECS(r)|Box Antares and Arneb 19" 1RU server enclosures which can run 24 and 72 Apalis System on Modules respectively in a cluster configuration.
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SECO's roadmap from NXP i.MX 6 to i.MX 8M
Amongst the most important innovations, SECO introduces an updated version of its Q7-928, a Qseven(r) standard module featuring the NXP(r) i.MX 6DualPlus applications processor that offers top computational and graphical performances given by the low-power consuming ARM architecture. The i.MX 6DualPlus processor is also an option for the SBC-A62-J, a low-end Single Board Computer that exploits the potential of a configurable expansion connector to fully meet the configuration flexibility needs. Both solutions can now benefit from the increased performances and enhanced 3D graphics delivered by the i.MX 6DualPlus processor.
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WinSystems Debuts Single Board Computers Built on Intel Atom E3900 Series CPU in PC/104 Form Factor for High-Reliability Industrial Environments
First PCIe(r)/104 OneBank(r) E3900-based product for industrial operations boosts processing performance, offers dense mix of I/O interfaces, connectivity and expansion options in a small size
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Intel SoC FPGA Developer Forum: ReFLEX CES Showcases Arria10 SoC FPGA Cards and OpenCL Solutions
ReFLEX CES Arria10 SoC solutions @ the ISDF show in San Francisco
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HELIX PC/104 SBC with DMP Vortex86DX3 SoC Targets Rugged, Low Price, Low Power Applications
Today Diamond Systems Corporation, a leading global supplier of compact, rugged, I/O-rich embedded computing solutions for real-world applications in a broad range of markets, unveiled its compact, rugged HELIX PC/104 single board computer based on the DMP Vortex86DX3 system-on-chip (SoC) processor.
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Trenz Electronic launches UltraSoM+ Zynq MPSoC-based system-on-module for next generation mil/aero embedded systems
TE0808 UltraSoM+ is a high-performance, industrial grade system-on-module delivering a host of advanced technologies packed into an extremely compact 52mm x 76mm form factor.
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Low-cost embedded development kits accelerate design cycles
Increasing time-to-market pressures have led to the availability of full-featured microcontrollers, sometimes called system-on-chip (SoC) processors. These feature-rich microcontrollers or SoCs speed design by integrating a part of or, in some cases, all of the hardware required to implement an embedded design. Developers can then focus their design efforts on application-level functionality.
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Pico-ITX packs a punch
It was only a matter of time: Thanks to Moore's Law, the smallest embedded open standard single-board computer (SBC) form factor has broken into the quad-core ranks. At a mere 72 by 100 mm, Pico-ITX boards are now available from a number of suppliers with Intel, AMD, and Freescale ARM processors. Thanks to tiny semiconductor geometries down to 14 nm, these processors are implemented as feature-rich systems-on-chip (SoCs) with one, two, and four cores and average power consumption below 10 W.
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congatec integrates new AMD Embedded R-Series SOC on COM Express
Rich and vibrant SOC graphics, full HSA 1.0 support, and even more performance starting at 12 watts