The FeaturePak Specification defines a highly-compact, low-profile, and inexpensive way to add configurable I/O functions to embedded systems. The tiny modules -- measuring just 1.70 x 2.55 inches (43 x 65 mm) -- can implement snap-in options or upgrades for off-the-shelf single board computers (SBCs) or computer-on-module (COM) baseboards, or can be used as building-blocks to simplify the development of fully-custom embedded electronics.

This new mezzanine-style embedded I/O expansion standard is highly synergistic with existing and emerging bus, I/O, chip and board-level technologies. It leverages the latest high-speed serial expansion standards -- such as PCI Express and USB -- and is compatible with a wide range of current and future processors, including both x86 and RISC architectures